The Galaxy S-series overheating as one of the biggest problems that has affected it over the years, but the next flagship chip in Samsung Exynos 2600 may have solved the issue. Recent reports suggest that the Galaxy S26 series planned to debut early-2026 will use the new Exynos 2600 (which boasts an ordinary-looking heat spreader) with an entirely novel cooling system called Heat Pass Block (HPB) that is of a completely new level in terms of mobile cooling (and which may or may not be an HPB).
The HPB system has small copper based heat sink mounted directly over the processor and memory all in a package-on-package (PoP) system. The newer design differs with the earlier ones in the way that the DRAM is alone at the top of the chip; the HPB in this new model is adjacent to the memory where more efficient heat removal can be provided to both the CPU and the RAM. Samsung wants to absorb heat in highly capable components and provide lower temperatures in stressful use and give more constant, long term performance.
The decision of Samsung follows the fact that Exynos chips remained less efficient in energy capacity as well as temperature management compared to Qualcomm Snapdragon chips. Initial indicators of Exynos 2600, which is based on a state-of-the-art 2nm process and has a new deca-core CPU and Xclipse GPU, promise it will not only perform better but also fix thermals of the past. Provided the testing stage is successful, there is a possibility that the HPB-improved chip would find a wide application throughout the S26 series rather than at the premium top only.
Here with expectations of the new cooling technology being met, it may also come with the return of Samsung in supplying the global market with its in-house Exynos processors - an age of cool and fast but not uncomfortable Galaxy phones may be on the way.
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